Process Integration - Introduction to Microelectronic Fabrication Processes - Lecture Notes, Study notes of Civil Engineering

Chapter 9: Process Integration

Short type questions

1. What is RC delay?

2. Explain how BEOL processes impact the overall yield significantly.

3. What is electromigration?

4. Why are Si and Cu added to aluminum in interconnect formation?

5. What is the purpose of a liner material?

6. What is the commonly used liner material for (a) aluminum technology? (b)

12. What is Blech length?

13. What are via-first scheme and trench-first scheme?

Long type questions

1. Explain why the speed of the modern chips is limited by BEOL part of the chip.

2. Using schematics, explain the aluminum metallization process

3. Explain Cu metallization integration scheme with illustrations.