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Understanding Processor Packages, Motherboard Compatibility, and Cooling Solutions - Prof., Study notes of Introduction to Business Management

Various processor packages, their reasons for existence, motherboard compatibility, and cooling solutions. Topics include the cpu package, reasons for different packages, motherboard slots and sockets, and processor cooling. Learn about the pin grid array (pga) and single edge cartridge (sec) packages, as well as motherboard compatibility issues and cooling methods.

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Pre 2010

Uploaded on 08/07/2009

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Physical Aspects of the Processor
September 6 (Day); September 5 (Night)
Processor Packages:
oThe CPU package is another name for the form factor of the processor: its shape,
size, and external features (p. 33).
oReasons for Different Packages (p. 33) :
As CPUs became faster and smarter, they used more pins to link them to
the motherboard.
As CPUs became faster and smarter, they tend to run hotter than older,
less sophisticated CPUs.
oThe Pin Grid Array (PGA) is a square package and has a large number of pins
extending from its bottom (p. 34).
An example of a PGA processor.
oA Single Edge Cartridge (SEC) is contained in a cartridge that snapped into a special
slot on the motherboard. It is rarely seen outside the Pentium II (p. 33).
An example of an SEC processor.
Motherboard Compatibility:
oA slot or socket is the physical connection used to connect a processor to the
motherboard. The processor slot or socket on the motherboard must match the slot or
socket required by your processor.
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Physical Aspects of the Processor September 6 (Day); September 5 (Night)  Processor Packages:

o The CPU package is another name for the form factor of the processor: its shape,

size, and external features (p. 33).

o Reasons for Different Packages (p. 33):

 As CPUs became faster and smarter, they used more pins to link them to the motherboard.  As CPUs became faster and smarter, they tend to run hotter than older, less sophisticated CPUs.

o The Pin Grid Array (PGA) is a square package and has a large number of pins

extending from its bottom (p. 34). An example of a PGA processor.

o A Single Edge Cartridge (SEC) is contained in a cartridge that snapped into a special

slot on the motherboard. It is rarely seen outside the Pentium II (p. 33). An example of an SEC processor.  Motherboard Compatibility: o A slot or socket is the physical connection used to connect a processor to the motherboard. The processor slot or socket on the motherboard must match the slot or socket required by your processor.

 A socket is the older connection. It is usually a square-shaped

connection where the processor lies flat into the motherboard.  Typically, processors with a PGA form factor plug into sockets.

 Slots were developed to accept cartridges. Slots are rectangular.

 Typically, processors with an SEC form factor plug into a slot.

o The typical motherboard supports a very limited number of CPUs. It often depends

on complex issues such as the socket or slot type or CPU speed (p. 38). o Motherboards come with motherboard books that describe in great detail all of the technical aspects of the motherboard. Here is the best place to look for motherboard compatibility (p. 39).

o Many makes and models of CPUs come in two or more socket types, so that you

cannot rely on entirely on the make and model of a CPU to determine whether your motherboard supports it (p. 39):  Pentium 4 processors, for example, come in two varieties: Socket 423 and Socket 478 (p. 39).

 Sockets and Slots:

o Socket 7 – 321 pins; used Pentium class chips, from 75MHz on up, MMX processors, the AMD K5, K6, K6-2, K6-3, 6x86, M2 and M3, and Pentium MMX Overdrives. Socket 7 o Slot 1 – 242 pins; rectangular; used in all Pentium 2; used by older Pentium 3 and Celeron. o Slot A – used by AMD Athlon o Socket 370 – 370 pins; used by newer Pentium 3’s.

o The temperature of the processor must be kept below the Intel maximum temperature of 185 degrees Fahrenheit. Using a heat sink and a fan can lower this temperature to 90-110 degrees Fahrenheit.

o A heat sink sits on top of the CPU and draws heat from the processor so that the fan

may dissipate it (p. 47).  Between the heat sink and the processor, you should apply thermal compound. Thermal compound prevents heat from escaping the area between the processor and heat sink (p. 48).

o The purpose of fans is to draw air from the processor and the heat sink (p. 48).

 Fans are judged according to size, airflow, and noise (p. 48).

o Thermal compound is grease or crème placed between the processor and the heat sink

or fan; used to eliminate air gaps and prevent heat from escaping before it reaches the heat sink or is cooled by the fan. Thermal Compound