Chapter 1 Materials for Engineering
A fly-by during deployment of the aircraft carrier USS
Stennis. The pilot was grounded for 30 days, but he
likes the picture and thinks it was worth it.
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Materials for Engineering - Material Science for Engineers - Lecture Slides, Slides of Material Engineering
These are the Lecture Slides of Material Science for Engineers which includes Structure of Wood, Moisture Content, Density of Wood, Mechanical Properties of Wood, Expansion and Contraction of Wood, Concrete Materials, Properties of Concrete etc. Key important points are: Materials for Engineering, Materials Science, Organization of Atoms, Electrons and Nuclei, Structure of Steel, Materials Selection Process, Crystal Structure, Electrical Resistivity of Copper
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Chapter 1 Materials for Engineering
A fly-by during deployment of the aircraft carrier USSStennis. The pilot was grounded for 30 days, but helikes the picture and thinks it was worth it.
Materials Science and
Engineering
• Materials Science – Investigating
relationships that exist between the structureand properties of materials
• Materials Engineering – Is, on the basis of
these structure-property correlations,designing or engineering the structure of amaterial to produce a pre-determined set ofproperties
Terminology
mil = 1 / 1000 inch = 25.4 μm
micrometer = 1 / 1,000,000 meter = 1μm
Angstrom = 1 / 10,000,000,000 meter = 1Å
1 MICROMETER IS TWO WAVELENGTHS OF GREEN LIGHT LONG
A HAIR IS 100 MICROMETERS
A 1 MICRON WIDE LINE ON A CD
IS THE SAME SCALE AS A 100 FOOTWIDE ROAD ON NORTH AMERICA
Progress in atomic-level understanding
DNA ~2 nm wide
Things Natural
Things Manmade
THE SCALE OF THINGS
(^10) nm
Cell membrane
ATP synthase
Schematic, central core
Cat ~ 0.3 m
Dust mite^300
μ
m
Monarch butterfly
~ 0.1 m
MEMS (MicroElectroMechanical Systems) Devices
10 -
μm wide^ Red blood cellsPollen grain
Fly ash ~ 10-
μm
Bee ~ 15 mm
Atoms of silicon spacing ~tenths of nm
Head of a pin
1-2 mm
Magnetic domains garnet
film 11
μm widestripes
Progress in miniaturization
Indium arsenidequantum dot
Quantum dot array -- germanium dots on silicon Microelectronics Objects fashioned from
metals, ceramics, glasses, polymers ...
Human hair ~ 50
μm wide
The
Microworld
0.01 1 nanometer (nm) 0.1 nm
μ m 0.1 10 nm
μ m 1 micrometer (100 nm
μ m)
0.01 mm 10
μ m 0.1 mm 100
μ m 1 meter (m)0.1 m100 mm0.01 m1 cm10 mm 1 millimeter (mm)
10
0 m 10
-1^ m 10
-2^ m 10
-3^ m 10
-4^ m 10
-5^ m 10
-6^ m 10
-7^ m 10
-8^ m 10
-9^ m 10
-^
m
Visiblespectrum
The
Nanoworld
The 21st century challenge -- Fashion materials at the nanoscale with desired properties and functionality
Red blood cellswith white cell
~ 2-
μ
m
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ex: hardness vs structure of steel
- Properties depend on structure
Data obtained from Figs. 10.21(a)and 10.23 with 4wt%C composition,and from Fig. 11.13 and associateddiscussion,
Callister 6e.
Micrographs adapted from (a) Fig.10.10; (b) Fig. 9.27;(c) Fig. 10.24;and (d) Fig. 10.12,
Callister 6e.
ex: structure vs cooling rate of steel
Structure, Processing, & Properties• Processing can change structure
Cooling Rate (C/s)
600500400300200100
1
10
100
1000
(a)
m
(b)
m
(d)
m
(c)
m
Hardness (BHN)
Pick Application
Determine required Properties
Properties
Identify candidate Material(s)
Material
Identify required Processing
Processing: changes
structure and overall
shape
ex: casting, sintering, vapor deposition, doping
forming, joining, annealing.
Properties: mechanical, electrical, thermal,magnetic, optical, deteriorative.Material: structure, composition.
The Materials Selection Process
T (°C)
Cu + 3.32 at%Ni
Cu + 2.16 at%Ni
deformed Cu + 1.12 at%Ni
ρ Resistivity,
Ohm-m)-8 (
Cu + 1.12 at%Ni
“Pure” Cu
• Electrical Resistivity of Copper:• Adding “impurity” atoms to Cu increases resistivity.• Deforming Cu increases resistivity.
Adapted from Fig. 18.8,
Callister 6e.
(Fig. 18.8 adapted from: J.O. Linde,Ann Physik 5, 219 (1932); andC.A. Wert and R.M. Thomson,Physics of Solids, 2nd edition,McGraw-Hill Company, New York,1970.)
ELECTRICAL
Magnetic Permeabilityvs. Composition:--Adding 3 atomic % Si
makes Fe a betterrecording medium!
Magnetic Field
Magnetization
Fe+3%Si
Fe
Adapted from C.R. Barrett, W.D. Nix, andA.S. Tetelman,
The Principles of
Engineering Materials, Fig. 1-7(a), p. 9,1973. Electronically reproducedby permission of Pearson Education, Inc.,Upper Saddle River, New Jersey.
Fig. 20.18,
Callister 6e.
(Fig. 20.18 is from J.U. Lemke,
MRS Bulletin,
Vol. XV, No. 3, p. 31, 1990.)
• Magnetic Storage:
--Recording medium
is magnetized byrecording head.
MAGNETIC
• Stress & Saltwater...
--causes cracks!
• Heat treatment:
slows
crack speed in salt water!
m
--material:
7150-T651 Al "alloy"(Zn,Cu,Mg,Zr)
Adapted from Fig. 11.20(b), R.W. Hertzberg, "Deformation andFracture Mechanics of Engineering Materials" (4th ed.), p. 505,John Wiley and Sons, 1996. (Original source: Markus O.Speidel, Brown Boveri Co.)
Adapted from Fig. 17.0,
Callister 6e.
(Fig. 17.0 is from
Marine Corrosion, Causes,
and Prevention, John Wiley and Sons, Inc.,1975.)
Adapted from Fig. 11.24,Callister 6e. (Fig. 11.24 provided courtesy of G.H.Narayanan and A.G. Miller, Boeing CommercialAirplane Company.)
“held at160C for 1hrbefore testing”
increasing load
crack speed (m/s)
“as-is”
10 -8 10 -
Alloy 7178 tested insaturated aqueous NaClsolution at 23C